Board: glass epoxy (multilayer) type gf per mil-p-13949; printed circuitry shall be 2 oz copper; connector and terminal holes plated through, mil-std-275; solder coat all exposed copper surfaces and plated through holes, mil-std-275, followed by reflow; apply polymer shlder mask coating in selective areas to support marking requirements on component side (layer 1) and dip side (layer 4) conforming to ipc-sm-840, class 3, color green; fabricate per mil-p-55110.
NSN 5935-01-479-8861
NSN 6130-00-688-7085
NSN 6145-00-251-0357
NSN 5935-00-405-5026
NSN 5950-01-513-2313
NSN 5915-00-255-2057
NSN 6135-01-098-3020
NSN 5985-01-397-7288
NSN 5999-00-269-5320
NSN 5930-01-360-0679
NSN 5895-00-728-3655
NSN 6620-01-173-3284
Last Updated: 12/24/2024