Board: glass epoxy (multilayer) type gf per mil-p-13949; printed circuitry shall be 2 oz copper; connector and terminal holes plated through, mil-std-275; solder coat all exposed copper surfaces and plated through holes, mil-std-275, followed by reflow; apply polymer shlder mask coating in selective areas to support marking requirements on component side (layer 1) and dip side (layer 4) conforming to ipc-sm-840, class 3, color green; fabricate per mil-p-55110.
NSN 2925-01-327-3069
NSN 5975-00-228-0227
NSN 5990-01-212-2037
NSN 7035-00-631-3782
NSN 5999-01-082-1878
NSN 6620-00-583-2687
NSN 6650-01-050-8680
NSN 5945-01-145-3179
NSN 5965-01-254-3622
NSN 5965-01-168-8180
NSN 6105-01-062-2122
NSN 6135-01-485-9082
Last Updated: 11/25/2024