Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 5985-01-515-6266
NSN 6130-01-314-0886
NSN 5945-01-370-4784
NSN 6105-00-937-4627
NSN 4140-01-549-4647
NSN 5990-01-571-7468
NSN 6105-01-311-3915
NSN 6645-01-182-4896
NSN 5965-01-376-7301
NSN 5905-01-412-1792
NSN 5965-00-957-5200
NSN 5950-01-476-8851
Last Updated: 01/11/2025