Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 7035-01-114-8550
NSN 5945-00-873-0854
NSN 5910-00-557-3495
NSN 6110-00-373-8691
NSN 5920-00-236-1118
NSN 5990-00-104-4903
NSN 5960-01-485-2467
NSN 6650-01-214-9728
NSN 7035-01-352-6235
NSN 6135-01-190-2628
NSN 5925-01-290-4808
NSN 6645-00-825-5677
Last Updated: 05/20/2024