Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 5965-01-414-6414
NSN 6145-00-299-7757
NSN 5996-01-538-9357
NSN 6240-00-782-1407
NSN 5895-00-185-4543
NSN 5905-01-393-5580
NSN 5945-00-201-7834
NSN 5960-00-462-7145
NSN 5975-01-157-3111
NSN 6220-01-412-9600
NSN 5935-01-062-2172
NSN 5920-00-549-2203
Last Updated: 01/30/2025