Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 6135-00-377-9165
NSN 5960-01-042-3337
NSN 6650-00-930-4707
NSN 5985-01-183-5331
NSN 5950-01-004-9326
NSN 5945-00-831-9130
NSN 5950-01-049-2451
NSN 6650-01-640-6941
NSN 5905-01-469-5478
NSN 2925-01-252-8049
NSN 5960-01-216-6393
NSN 5935-01-391-4980
Last Updated: 12/23/2024