#302706 Semiconductor Device Heat Sink | Miscellaneous Electrical And Electronic Components

302706

Electrical-electronic Heat Sink

NSN 5999-01-380-3153

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
013803153

Technical Specifications of NSN

Thread Class:
2b fourth mounting facility
Thread Class:
2b third mounting facility
Overall Width:
2.330 inches
Unthreaded Mounting Hole Diameter:
0.515 inches first mounting facility
Mounting Facility Type And Quantity:
1 unthreaded hole first mounting facility
Mounting Facility Type And Quantity:
1 unthreaded hole second mounting facility
Mounting Facility Type And Quantity:
2 threaded hole third mounting facility
Mounting Facility Type And Quantity:
4 threaded hole fourth mounting facility
Thread Size:
0.089 inches fourth mounting facility
Thread Size:
0.136 inches third mounting facility
Thread Tolerance Class:
2 internal fourth mounting facility
Thread Tolerance Class:
2 internal third mounting facility
Material:
Metal
Surface Treatment:
Chromate
Surface Treatment Specification:
Mil-c-5541, class 3 military specification single treatment response
Thread Series Designator:
Unc fourth mounting facility
Thread Series Designator:
Unc third mounting facility
NSN:
5999-01-380-3153
Item Name:
Heat Sink,semiconductor Device
Cage Code:
3BC99

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
1737AS30270-6
Cage Code:
30003
RNCC:
3
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
30270-6
Cage Code:
12175
RNCC:
5
RNVC:
9
RNAAC:
ZZ
Status:
A
MSDS:
SADC:

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Catalog Drilldown
--- Electrical And Electronic Equipment Components
------ Miscellaneous Electrical And Electronic Components
--------- Electrical Electronic Heat Sinks
------------ P/N 302706

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Last Updated: 07/06/2024