NSN 5961-01-655-2317

Semiconductor Device Assembly

DEMIL

Shelf Life

UOM

NIIN

Demil:

Shelf Life:

N/A

UOM:

NIIN:

016552317

Pricing & Availability

Submit this form for current pricing and availability quote on part number and/or cross reference parts.

Definition Definition of approved item name (AIN): "SEMICONDUCTOR DEVICE ASSEMBLY"

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.

5961-01-655-2317 Spec. NSN part characteristics

MRC

Name

Detail

MRC:

AGAV

End Application

Hawker 800xp/850xp

MRC:

CXCY

Part Name Assigned By Controlling Agency

Board-printed circuit

MRC:

FEAT

Special Features

Board-printed circuit, da, digital

Cross Reference Parts Part numbers that meet the specification outlined on this page and set by the OEM

Part Number

Cage

RNCC

RNVC

DAC

RNAAC

Status

MSDS

SADC

Part Number:

25-6NF1909-43A

Cage Code:

70898

RNCC:

RNVC:

DAC:

RNAAC:

Status:

MSDS:

SADC:

Indicates a design/source control reference item

Inidicates part number has been superseded

Identification Item Identification Guide (IIG) and Item Name Code (INC)

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

35565

FIIG:

T01200

Concept No.:

App. Key:

Cond. Code:

Status:

Part End Users MOE: Major organizational entities

Name

MOE Code

MOE Rule

PICA

DSOR

User:

Republic of Korea

MOE:

Rule:

ZH01

PICA:

DSOR: