1.375 in. Lg; 0.156 in. W; 0.406 in. H; 0.250 in. Max opening
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 6220-00-719-7714
NSN 5950-01-420-7752
NSN 5905-01-347-1040
NSN 5960-00-831-8683
NSN 5855-01-400-1590
NSN 5905-00-801-8658
NSN 5915-01-164-6283
NSN 5960-01-090-9291
NSN 5925-01-371-6994
NSN 5835-00-170-5238
NSN 5975-00-661-1832
NSN 6685-01-509-6512