1.375 in. Lg; 0.156 in. W; 0.406 in. H; 0.250 in. Max opening
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 6320-01-512-2031
NSN 6240-00-548-3992
NSN 5910-01-360-5393
NSN 5855-01-451-6430
NSN 5996-01-526-0538
NSN 6320-01-380-7372
NSN 2925-01-055-7607
NSN 6240-01-067-6457
NSN 6145-00-955-0032
NSN 6645-01-174-4363
NSN 5925-00-820-6415
NSN 6620-00-724-1263