1.375 in. Lg; 0.156 in. W; 0.406 in. H; 0.250 in. Max opening
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 6685-01-386-4802
NSN 5935-01-442-7638
NSN 6135-01-277-7397
NSN 6650-01-209-6318
NSN 5996-00-222-6049
NSN 6685-01-274-0759
NSN 6135-00-593-6831
NSN 4140-01-235-1757
NSN 6240-01-131-3223
NSN 5835-01-242-9806
NSN 5855-00-185-1560
NSN 5985-01-065-0959