1818-0439

Memory Microcircuit

NSN 5962-01-194-7655

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
011947655

Technical Specifications of NSN

Body Length:
Between 0.885 inches and 0.915 inches
Body Width:
Between 0.285 inches and 0.305 inches
Body Height:
Between 0.125 inches and 0.165 inches
Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Storage Tempurature Range:
-65.0/+150.0 degrees celsius
End Application:
7010-01-090-9923 computor system
Features Provided:
3-state output
Inclosure Material:
Ceramic
Inclosure Configuration:
Dual-in-line
Output Logic Form:
Complementary-metal oxide-semiconductor logic
Input Circuit Pattern:
16 input
Terminal Surface Treatment:
Solder
Voltage Rating And Type Per Characteristic:
-0.3 volts power source and 8.0 volts power source
Memory Device Type:
Ram
Test Data Document:
96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).
Terminal Type And Quantity:
18 printed circuit
NSN:
5962-01-194-7655
Item Name:
Pal Assembly
Cage Code:
1LQK8

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
HM1-6561B/883
Cage Code:
1MY79
RNCC:
C
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
9F
Part Number:
HM1-6561B-8
Cage Code:
1MY79
RNCC:
C
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
9F
Part Number:
HM1-6561B-8
Cage Code:
34371
RNCC:
3
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
1818-0439
Cage Code:
28480
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
HM1-6561B/883
Cage Code:
34371
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE ARMY Dept. of the Army
DSOR:
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
User:
U.S. MARINE CORPS U.s. Marine Corps
DSOR:
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
DSOR:
User:
AUSTRALIA Australia
DSOR:
User:
GERMANY Germany
DSOR:
User:
ITALY Italy
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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