184SHB308

Transistor

NSN 5961-00-348-5788

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
003485788

Product Features

Junction pattern arrangement: npn

Technical Specifications of NSN

Inclosure Material:
Metal
Overall Length:
Between 0.345 inches and 0.400 inches
Overall Diameter:
0.400 inches
Mounting Facility Quantity:
1
Internal Configuration:
Junction contact
Mounting Method:
Threaded stud
Features Provided:
Hermetically sealed case
Overall Width Across Flats:
Between 0.427 inches and 0.437 inches
Thread Size:
0.190 inches
Semiconductor Material:
Silicon
Voltage Rating In Volts Per Characteristic:
80.0 breakdown voltage, collector-to-base, emitter open and 70.0 breakdown voltage, collector-to-emitter, base open and 8.0 breakdown voltage, emitter-to-base, collector open
Current Rating Per Characteristic:
Between 0.50 amperes source cutoff current and 5.00 amperes source cutoff current
Power Rating Per Characteristic:
300.0 milliwatts small-signal input power, common-collector
Maximum Operating Tempurature Per Measurement Point:
200.0 degrees celsius junction
Thread Series Designator:
Unf
Terminal Type And Quantity:
3 tab, solder lug
NSN:
5961-00-348-5788
Item Name:
Hexfet Power Mosfet
Cage Code:
21845

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
20A2655-1
Cage Code:
92755
RNCC:
3
RNVC:
2
RNAAC:
KE
Status:
A
MSDS:
SADC:
Part Number:
SDT6476
Cage Code:
21845
RNCC:
5
RNVC:
1
RNAAC:
KE
Status:
A
MSDS:
SADC:
Part Number:
PT9380
Cage Code:
01281
RNCC:
5
RNVC:
9
RNAAC:
KE
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
20588
FIIG:
A110A0
Concept No.:
App. Key:
D
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Hexfet Power Mosfet"

An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
DSOR:
User:
FRANCE France
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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