21474

Semiconductor Device Assembly

NSN 5961-00-145-5610

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
001455610

Product Technical Spec.

Overall Length:
1.600 inches
Overall Height:
0.750 inches
Overall Width:
1.500 inches
Major Components:
Transistor 2; plate heat dissipator 2; block heat dissipator 1
End Application:
Rt-859/apx72
Mounting Configuration:
Four 4-40 unc-2b threaded holes
Test Data Document:
06845-2077938-0001 specification (includes engineering type bulletins, brochures, etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "", etc.).
NSN:
5961-00-145-5610
Item Name:
Blocking Diode Assembly
Cage Code:
59475

Cross Referenced Parts

No other part numbers with same form, fit, and function found.

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
35565
FIIG:
T01200
Concept No.:
App. Key:
C
Cond. Code:
2
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
657
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Blocking Diode Assembly"

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.

MOE Major Organizational Entities

Entity
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User:
DEPARTMENT OF THE ARMY Dept. of the Army
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DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
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DEPARTMENT OF THE NAVY Dept. of the Navy
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U.S. COAST GUARD U.s. Coast Guard
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BRAZIL Brazil
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SPAIN Spain
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KUWAIT Kuwait
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MALAYSIA Malaysia
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AUSTRALIA Australia
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CANADA Canada
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NEW ZEALAND New Zealand
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REPUBLIC OF KOREA Republic of Korea
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PORTUGAL Portugal
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DENMARK Denmark
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NORWAY Norway
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GREECE Greece
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TURKEY Turkey
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Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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