227B7790-1

Memory Microcircuit

NSN 5962-01-451-1878

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
1 EA
NIIN:
014511878

Technical Specifications of NSN

Operating Tempurature Range:
-55.0/+125.0 degrees celsius
End Application:
1430-01-378-6963 guide missile battery control
Features Provided:
Tested to mil-std-883 and 3-state output
Inclosure Material:
Ceramic
Inclosure Configuration:
Dual-in-line
Output Logic Form:
Complementary-metal oxide-semiconductor logic
Terminal Surface Treatment:
Solder
Part Name Assigned By Controlling Agency:
16k (2k x 8) cmos eeprom
Voltage Rating And Type Per Characteristic:
5.0 volts input
Memory Device Type:
Eeprom
Terminal Type And Quantity:
28 printed circuit
NSN:
5962-01-451-1878
Item Name:
Pal Assembly
Cage Code:
05606

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
ROM/PROM
Cage Code:
16236
RNCC:
5
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
227B7790-2
Cage Code:
05606
RNCC:
3
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
AT28C17E-25DM/883
Cage Code:
1FN41
RNCC:
5
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
AT28C17-25DM/883
Cage Code:
1FN41
RNCC:
5
RNVC:
9
RNAAC:
ZZ
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE ARMY Dept. of the Army
DSOR:
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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