2708JL

Memory Microcircuit

NSN 5962-01-055-0311

DEMIL

Shelf Life

UOM

NIIN

Demil:

DEMIL/MLI

Shelf Life:

N/A

UOM:

1 EA

NIIN:

010550311

Product Technical Spec.

Overall Length:

Between 1.185 inches and 1.235 inches

Overall Height:

0.325 inches

Body Length:

Between 1.185 inches and 1.215 inches

Body Width:

Between 0.570 inches and 0.605 inches

Body Height:

0.145 inches

Maximum Power Dissipation Rating:

800.0 milliwatts

Operating Tempurature Range:

+0.0/+70.0 degrees celsius

Storage Tempurature Range:

-65.0/+125.0 degrees celsius

Features Provided:

Static operation and 3-state output and ultraviolet erasable and w/enable and monolithic and hermetically sealed

Inclosure Material:

Ceramic

Inclosure Configuration:

Dual-in-line

Output Logic Form:

N-type metal oxide-semiconductor logic

Input Circuit Pattern:

11 input

Current Rating Per Characteristic:

65.00 milliamperes reverse current, dc absolute

Terminal Surface Treatment:

Solder

Voltage Rating And Type Per Characteristic:

15.0 volts power source

Capitance Rating Per Characteristic:

6.00 input picofarads and 12.00 output picofarads

Time Rating Per Chacteristic:

450.00 nanoseconds access

Memory Device Type:

Eprom

Terminal Type And Quantity:

24 printed circuit

NSN:

5962-01-055-0311

Item Name:

Pal Assembly

Cage Code:

34649

Cross Referenced Parts

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

51047-0001

Cage Code:

27914

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

2708DC

Cage Code:

07263

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

177-0001

Cage Code:

54817

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

C2708

Cage Code:

7U050

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

41015

FIIG:

A458A0

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

0.1000lbs

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

061700

UFC:

34580

LTL:

RATING VARIABLE

LCL:

77.5

WCC:

738

TCC:

SHC:

ACC:

Instruments/Radio

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Pricing & Availability

Submit this form for current pricing and availability quote on part number 2708jl and/or cross reference parts.

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.