29651ADM883B

Memory Microcircuit

NSN 5962-01-356-0904

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
UOM:
NIIN:
013560904

Technical Specifications of NSN

Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Features Provided:
Burn in, mil-std-883, class b and low power and programmable and schottky
Inclosure Material:
Ceramic
Inclosure Configuration:
Dual-in-line
Memory Device Type:
Rom
Terminal Type And Quantity:
18 pin
NSN:
5962-01-356-0904
Item Name:
Pal Assembly
Cage Code:
3B150

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
R29651ADM/883B
Cage Code:
07933
RNCC:
3
RNVC:
2
RNAAC:
9Z
Status:
A
MSDS:
SADC:
Part Number:
29651ADM/883B
Cage Code:
49956
RNCC:
5
RNVC:
9
RNAAC:
9Z
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
ESD:
MMAC:
CRITL:
X

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
--
WCC:
738
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
FRANCE France
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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