2N3854

Transistor

NSN 5961-00-763-7890

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
007637890

Product Features

Junction pattern arrangement: npn

Technical Specifications of NSN

Inclosure Material:
Metal
Overall Length:
0.265 inches
Terminal Length:
0.500 inches
Overall Height:
0.140 inches
Overall Width:
0.205 inches
Internal Configuration:
Junction contact
Mounting Method:
Terminal
Features Provided:
Hermetically sealed case
Semiconductor Material:
Silicon
Voltage Rating In Volts Per Characteristic:
30.0 breakdown voltage, collector-to-base, emitter open and 30.0 breakdown voltage, collector-to-emitter, base open and 4.0 breakdown voltage, emitter-to-base, collector open
Current Rating Per Characteristic:
100.00 milliamperes source cutoff current
Power Rating Per Characteristic:
200.0 milliwatts small-signal input power, common-collector
Terminal Type And Quantity:
3 uninsulated wire lead
Specification Data:
80131-release4982 professional/industrial association specification
NSN:
5961-00-763-7890
Item Name:
Hexfet Power Mosfet
Cage Code:
03508

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
RELEASE4982
Cage Code:
80131
RNCC:
5
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
4901-03-8541
Cage Code:
34280
RNCC:
C
RNVC:
1
RNAAC:
48
Status:
A
MSDS:
SADC:
AH
Part Number:
2N3854A
Cage Code:
80131
RNCC:
3
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
2N3854A
Cage Code:
14321
RNCC:
5
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
2N3854A
Cage Code:
03508
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
20588
FIIG:
A110A0
Concept No.:
App. Key:
D
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Privacy | Terms

Definition Definition of approved item name (AIN): "Hexfet Power Mosfet"

An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE ARMY Dept. of the Army
DSOR:
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
DSOR:
User:
TENNESSEE VALLEY AUTHORITY Tennessee Valley Authority
DSOR:
User:
POLAND Poland
DSOR:
User:
BRAZIL Brazil
DSOR:
User:
SPAIN Spain
DSOR:
User:
SINGAPORE Singapore
DSOR:
User:
NEW ZEALAND New Zealand
DSOR:
User:
GERMANY Germany
DSOR:
User:
REPUBLIC OF KOREA Republic of Korea
DSOR:
User:
GREECE Greece
DSOR:
User:
TURKEY Turkey
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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