3262013-2

Memory Microcircuit

NSN 5962-01-419-5006

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
1 EA
NIIN:
014195006

Technical Specifications of NSN

Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Inclosure Configuration:
Dual-in-line
Terminal Surface Treatment:
Solder
Part Name Assigned By Controlling Agency:
Programmed 32k x 8 eprom
Voltage Rating And Type Per Characteristic:
5.5 volts power source
Time Rating Per Chacteristic:
250.00 nanoseconds access
Memory Device Type:
Rom
Terminal Type And Quantity:
28 printed circuit
NSN:
5962-01-419-5006
Item Name:
Pal Assembly
Cage Code:
10236

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
ROM/PROM
Cage Code:
16236
RNCC:
5
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
5962-8606302XA
Cage Code:
67268
RNCC:
5
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
BQ
CRITL:
X

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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