338187-2

Unitized Semiconductor Devices

NSN 5961-00-927-5356

DEMIL

Shelf Life

UOM

NIIN

Demil:

Shelf Life:

N/A

UOM:

1 EA

NIIN:

009275356

Detail Specifications

Inclosure Material:

Metal

Overall Length:

0.210 inches

Overall Diameter:

0.230 inches

Component Name And Quantity:

2 transistor

Mounting Method:

Terminal

Semiconductor Material:

Silicon all semiconductor

Voltage Rating In Volts Per Characteristic:

50.0 gate to source voltage all transistor

Current Rating Per Characteristic:

50.00 milliamperes source cutoff current absolute all transistor

Power Rating Per Characteristic:

300.0 milliwatts small-signal input power, common-collector absolute all semiconductor

Test Data Document:

94853-301870 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

Terminal Type And Quantity:

6 uninsulated wire lead

NSN:

5961-00-927-5356

Item Name:

Diode Array

Cage Code:

56232

Manufacturer Part Numbers

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

2N3921

Cage Code:

15818

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

2N3921

Cage Code:

21845

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

301870

Cage Code:

22915

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

2N3921

Cage Code:

32293

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

DN1075

Cage Code:

17856

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

FD1887

Cage Code:

21845

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

61962

FIIG:

A110A0

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

0.1000lbs

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

063025

UFC:

34525

LTL:

100.0

LCL:

WCC:

72D

TCC:

SHC:

ACC:

Instruments/Radio

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Pricing & Availability

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Definition Definition of approved item name (AIN): "Diode Array"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.