3600-06

Memory Microcircuit

NSN 5962-00-331-7584

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
1 EA
NIIN:
003317584

Product Features

40 uv per degrees c temp coefficient of input offset voltage

Product Technical Spec.

Body Outside Diameter:
Between 0.335 inches and 0.370 inches
Body Height:
Between 0.165 inches and 0.185 inches
Maximum Power Dissipation Rating:
500.0 milliwatts
Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Storage Tempurature Range:
-65.0/+150.0 degrees celsius
Features Provided:
Hermetically sealed and monolithic and negative outputs and positive outputs
Inclosure Material:
Glass and metal
Inclosure Configuration:
Can
Input Circuit Pattern:
4 input
Case Outline Source And Designator:
T0-99 joint electron device engineering council
Terminal Surface Treatment:
Gold
Voltage Rating And Type Per Characteristic:
10.0 volts power source
Memory Device Type:
Rom
Precious Material And Location:
Terminals gold
Precious Material:
Gold
Terminal Type And Quantity:
8 pin
NSN:
5962-00-331-7584
Item Name:
Pal Assembly
Cage Code:
16067

Cross Referenced Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
C1C200-3
Cage Code:
16067
RNCC:
C
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
AC
Part Number:
CIC200-3
Cage Code:
16067
RNCC:
3
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
CIC200-3
Cage Code:
25965
RNCC:
C
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
9F
Part Number:
3-60006
Cage Code:
25965
RNCC:
C
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
9F

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
G
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
SPI No.:
SPI Rev.:
SPC Mkg:
39
LVL_A:
E
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
GERMANY Germany
DSOR:
User:
ITALY Italy
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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