500-0670REV.B

Electrical-electronic Compo Oven

NSN 5955-01-289-8898

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
1 EA
NIIN:
012898898

Detail Specifications

Overall Depth:
2.000 inches
Body Width:
2.000 inches
End Application:
An/tsm-131a
Inclosure Type:
Inclosed
Mounting Facility Type And Quantity:
2 threaded stud
Bodyheight:
4.000 inches
Furnished Crystal Unit Specificationified Frequency:
10.000 megahertz
Component Type And Quantity Accommodated:
1 crystal
Style Designator:
Solder connected
NSN:
5955-01-289-8898
Item Name:
Thermal Assembly,electronic Circuit
Cage Code:
62821

Manufacturer Part Numbers

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
500-0670
Cage Code:
62821
RNCC:
5
RNVC:
9
RNAAC:
MB
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41012
FIIG:
A144A0
Concept No.:
App. Key:
A
Cond. Code:
2
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
ESD:
MMAC:
QC
CRITL:
X

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
100.0
WCC:
72D
TCC:
Z
SHC:
Q
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Electronic Circuit Thermal Assembly"

An electrically heated compartment designed to accommodate and maintain at an essentially constant temperature, one or more components, such as, crystal unit(s), quartz; tuned circuits; integrated circuit devices; and semiconductors. It prevents frequency drift and changes in teperature.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
99
Import / Export
  • Schedule B: 8541900000
  • SITC: 77688
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Diode, transistor & similar semiconductor device parts


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