52CLR00A0001

Unitized Semiconductor Devices

NSN 5961-01-026-2435

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
EA
NIIN:
010262435

Product Features

All transistor junction pattern arrangement: npn

Technical Specifications of NSN

Inclosure Material:
Ceramic
NSN:
5961-01-026-2435
Item Name:
Common Cathode Matrix
Cage Code:
K7253

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
405906
Cage Code:
12909
RNCC:
C
RNVC:
1
RNAAC:
48
Status:
A
MSDS:
SADC:
AH
Part Number:
CA3083F
Cage Code:
34371
RNCC:
3
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
Q67000-A1929-Z
Cage Code:
C4751
RNCC:
5
RNVC:
2
RNAAC:
ZG
Status:
A
MSDS:
SADC:
Part Number:
44597 28126
Cage Code:
D8385
RNCC:
5
RNVC:
2
RNAAC:
ZG
Status:
A
MSDS:
SADC:
Part Number:
CA3083F
Cage Code:
18714
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
Q67000-A1929-Z
Cage Code:
D1180
RNCC:
5
RNVC:
9
RNAAC:
ZG
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
658
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Common Cathode Matrix"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
DSOR:
User:
FEDERAL AVIATION ADMINISTRATION Federal Aviation Administration
DSOR:
User:
SINGAPORE Singapore
DSOR:
User:
AUSTRALIA Australia
DSOR:
User:
GERMANY Germany
DSOR:
User:
UNITED KINGDOM United Kingdom
DSOR:
User:
NORWAY Norway
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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