63C502262P12

Memory Microcircuit

NSN 5962-01-043-4933

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
EA
NIIN:
010434933

Technical Specifications of NSN

Body Length:
Between 1.200 inches and 1.220 inches
Body Width:
Between 0.575 inches and 0.595 inches
Body Height:
Between 0.105 inches and 0.145 inches
Operating Tempurature Range:
+0.0/+70.0 degrees celsius
Storage Tempurature Range:
-65.0/+150.0 degrees celsius
Features Provided:
Hermetically sealed and monolithic and w/enable and negative outputs and positive outputs and programmable and programmed and w/storage and w/decoded output and bipolar and 3-state output
Inclosure Material:
Glass and metal
Inclosure Configuration:
Dual-in-line
Output Logic Form:
P-type metal oxide-semiconductor logic
Input Circuit Pattern:
11 input
Terminal Surface Treatment:
Gold
Voltage Rating And Type Per Characteristic:
20.0 volts power source
Time Rating Per Chacteristic:
850.00 nanoseconds propagation delay time, low to high level output
Memory Device Type:
Rom
Memory Capacity:
Unknown
Precious Material And Location:
Terminals gold and body gold
Precious Material:
Gold
Terminal Type And Quantity:
24 printed circuit
NSN:
5962-01-043-4933
Item Name:
Pal Assembly
Cage Code:
16331

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
MM5213AAA/D
Cage Code:
27014
RNCC:
3
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
DMS 76002B
Cage Code:
16236
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
G
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
SPI No.:
SPI Rev.:
SPC Mkg:
39
LVL_A:
E
LVL_B:
Q

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
SPAIN Spain
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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