7-352-000113

Semiconductor Device Assembly

NSN 5961-01-100-2359

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
011002359

Product Technical Spec.

Overall Length:
2.500 inches
Major Components:
Heat shrink tubing 1
NSN:
5961-01-100-2359
Item Name:
Light Emitting Diode-semiconductor Device,photo Assembly
Cage Code:
12361

Cross Referenced Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
C151021
Cage Code:
13509
RNCC:
5
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
B7-352-000113
Cage Code:
12361
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
B7-352-000113
Cage Code:
12361
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
C151021
Cage Code:
13509
RNCC:
5
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
B7-352-000113
Cage Code:
12361
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
C151021
Cage Code:
13509
RNCC:
5
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
B7-352-000113
Cage Code:
12361
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
35565
FIIG:
T01200
Concept No.:
App. Key:
C
Cond. Code:
2
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Photo Assembly Light Emitting Diode-semiconductor Device"

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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