7570860-100

Memory Microcircuit

NSN 5962-01-357-5595

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
013575595

Product Technical Spec.

Overall Length:
Between 0.675 inches and 0.700 inches
Overall Height:
Between 0.085 inches and 0.190 inches
Overall Width:
Between 0.675 inches and 0.700 inches
Body Length:
Between 0.640 inches and 0.660 inches
Body Width:
Between 0.640 inches and 0.660 inches
Body Height:
Between 0.075 inches and 0.155 inches
Maximum Power Dissipation Rating:
750.0 milliwatts
Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Storage Tempurature Range:
-65.0/+150.0 degrees celsius
Features Provided:
Bidirectional and electrostatic sensitive and high reliability and monolithic and asynchronous and ultraviolet erasable
Inclosure Material:
Ceramic
Inclosure Configuration:
Leaded chip carrier
Output Logic Form:
Transistor-transistor logic
Input Circuit Pattern:
38 input
Current Rating Per Characteristic:
150.00 milliamperes reverse current, dc absolute
Terminal Surface Treatment:
Solder
Voltage Rating And Type Per Characteristic:
-2.0 volts power source and 7.0 volts power source
Memory Device Type:
Pal
Test Data Document:
96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).
Terminal Type And Quantity:
44 pin
NSN:
5962-01-357-5595
Item Name:
Memory Upgrade
Cage Code:
13160

Cross Referenced Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
EP900JM883B
Cage Code:
67183
RNCC:
5
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
ROM/PROM
Cage Code:
16236
RNCC:
5
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
EP900JMB
Cage Code:
67183
RNCC:
5
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
EP900JM883B
Cage Code:
67183
RNCC:
5
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
ROM/PROM
Cage Code:
16236
RNCC:
5
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
EP900JMB
Cage Code:
67183
RNCC:
5
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Memory Upgrade"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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