Aplanar passivated chips, very short recovery time, extremely low switching losses, soft recovery behavior. High reliability circuit operation, low voltage peaks for reduced protection circuits.
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.
Classification: Semiconductor devices, nesoi
NSN 4140-00-144-6833
NSN 5920-00-318-7150
NSN 5930-01-173-2340
NSN 6610-00-867-6403
NSN 5965-01-525-3633
NSN 6130-00-361-7114
NSN 6220-01-289-6492
NSN 5920-00-616-4087
NSN 5999-01-217-8812
NSN 5945-01-526-8231
NSN 5990-00-402-1715
NSN 5925-01-363-3245