848125

Unitized Semiconductor Devices

NSN 5961-01-107-1052

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
011071052

Technical Specifications of NSN

Overall Length:
0.500 inches
Overall Height:
0.620 inches
Overall Width:
0.500 inches
Component Name And Quantity:
2 semiconductor device diode
Current Rating Per Characteristic:
1.00 milliamperes source cutoff current horsepower metric all semiconductor device diode
Power Rating Per Characteristic:
250.0 milliwatts small-signal input power, common-collector preset all semiconductor device diode
Maximum Operating Tempurature Per Measurement Point:
150.0 degrees celsius ambient air
NSN:
5961-01-107-1052
Item Name:
Dual Diode
Cage Code:
3B150

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
848125
Cage Code:
49956
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
A2X1175
Cage Code:
14844
RNCC:
5
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
A2X1175
Cage Code:
21847
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
848125
Cage Code:
54X10
RNCC:
5
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Dual Diode"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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