89954-356A1409P1

Memory Microcircuit

NSN 5962-01-506-3333

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
1 EA
NIIN:
015063333

Technical Specifications of NSN

Body Length:
20.100 millimeters
Body Width:
14.000 millimeters
Body Height:
1.500 millimeters
Operating Tempurature Range:
+0.0/+70.0 degrees celsius
Storage Tempurature Range:
-65.0/+150.0 degrees celsius
End Application:
Used in 114e6472g1
Features Provided:
Electrostatic sensitive and synchronous and high speed and low power and positive edge triggered and asynchronous
Inclosure Material:
Plastic
Inclosure Configuration:
Flat pack
Part Name Assigned By Controlling Agency:
4mb flow-through syncburst sram
Voltage Rating And Type Per Characteristic:
-0.5 volts input and 4.6 volts input
Memory Device Type:
Ram
Memory Capacity:
3.3 v i/o memory 128kx36
Terminal Type And Quantity:
100 gullwing
NSN:
5962-01-506-3333
Item Name:
Pal Assembly
Cage Code:
89954

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
356A1409P1
Cage Code:
89954
RNCC:
3
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
MT58L128L36PT-7.5
Cage Code:
6Y440
RNCC:
5
RNVC:
9
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
356A1409
Cage Code:
89954
RNCC:
D
RNVC:
9
RNAAC:
ZZ
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
User:
POLAND Poland
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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