900555-5

Transistor

NSN 5961-00-945-2793

DEMIL

Shelf Life

UOM

NIIN

Demil:

Shelf Life:

N/A

UOM:

1 EA

NIIN:

009452793

Product Features

Junction pattern arrangement: npn

Technical Specifications of NSN

Inclosure Material:

Metal

Overall Length:

1.218 inches

Mounting Facility Quantity:

Internal Configuration:

Junction contact

Joint Electronic Device Engineering Council/jedec/case Outline Designation:

To0-59

Mounting Method:

Threaded stud

Features Provided:

Hermetically sealed case

Overall Width Across Flats:

0.437 inches

Thread Size:

0.190 inches

Semiconductor Material:

Silicon

Voltage Rating In Volts Per Characteristic:

100.0 breakdown voltage, collector-to-base, emitter open and 8.0 breakdown voltage, emitter-to-base, collector open and 100.0 breakdown voltage, collector-to-emitter, base open

Current Rating Per Characteristic:

5.00 amperes source cutoff current and 1.00 amperes source cutoff current

Power Rating Per Characteristic:

3.0 watts small-signal input power, common-collector

Transfer Ratio:

120.0 static forward current transfer ratio, common-emitter

Maximum Operating Tempurature Per Measurement Point:

200.0 degrees celsius junction

Thread Series Designator:

Unf

Terminal Type And Quantity:

3 tab, solder lug and 1 threaded stud

NSN:

5961-00-945-2793

Item Name:

Hexfet Power Mosfet

Cage Code:

06481

Other Related Parts

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

900555-5

Cage Code:

31338

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

TN908

Cage Code:

12969

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

MHT6423

Cage Code:

21845

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

PT2972

Cage Code:

01281

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

20588

FIIG:

A110A0

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

0.1000lbs

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

063025

UFC:

34525

LTL:

RATING VARIABLE

LCL:

WCC:

658

TCC:

SHC:

ACC:

Instruments/Radio

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Pricing & Availability

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Definition Definition of approved item name (AIN): "Hexfet Power Mosfet"

An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.