9282660-01

Adhesive

NSN 8040-00-133-5434

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
6 mo.
UOM:
KT
NIIN:
001335434

Product Features

Silver plated copper filler; electrically conductive; service temperature range of minus 67 degrees f to plus 257 degrees f

Product Technical Spec.

Physical Form:
Paste
Quantity Within Each Unit Package:
1.000 pounds
Specific Usage Design:
For emi shielding applications
Features Provided:
Separate catalyst and heat vulcanize feature
Color:
Silver
Material:
Silicone
Supplementary Features:
1 pound kit
NSN:
8040-00-133-5434
Item Name:
Low Density Core Potting Material
Cage Code:
98752

Cross Referenced Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
CHO-BOND 1029
Cage Code:
18565
RNCC:
3
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
CHOBOND1029
Cage Code:
U4299
RNCC:
5
RNVC:
1
RNAAC:
ZK
Status:
A
MSDS:
SADC:
Part Number:
8040066
Cage Code:
10236
RNCC:
5
RNVC:
1
RNAAC:
75
Status:
A
MSDS:
SADC:
Part Number:
M53846LP
Cage Code:
79500
RNCC:
C
RNVC:
1
RNAAC:
75
Status:
A
MSDS:
SADC:
AZ
Part Number:
P6175-2
Cage Code:
81755
RNCC:
C
RNVC:
1
RNAAC:
75
Status:
A
MSDS:
SADC:
AI
Part Number:
L02960
Cage Code:
K0967
RNCC:
5
RNVC:
2
RNAAC:
ZK
Status:
A
MSDS:
SADC:
Part Number:
50-01-1029-0000
Cage Code:
18565
RNCC:
5
RNVC:
2
RNAAC:
75
Status:
A
MSDS:
SADC:
Part Number:
68A52956P2
Cage Code:
07868
RNCC:
5
RNVC:
9
RNAAC:
75
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
11297
FIIG:
A535P0
Concept No.:
App. Key:
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
Y
PMIC:
A
ESD:
ESD:
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
33
LVL_A:
4
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
004620
UFC:
02480
LTL:
RATING VARIABLE
LCL:
--
WCC:
705
TCC:
R
SHC:
9
ACC:
Construction Materials

MSDS Material safety data sheets

CHOMERICS INC
Cho-bond 1029 Part B
Download MSDS BGTMF
CHOMERICS INC.
Cho-bond 1029 Part A
Download MSDS BGVQB
CHOMERICS INC.
Cho-bond 1029 Part A
Download MSDS CCXMW
CHOMERICS INC
Cho-bond 1029 Part B
Download MSDS CCXMX

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Low Density Core Potting Material"

A substance compounded for binding materials together by surface attachment. It is not used primarily to fill voids or pores or for sealing purposes. Excludes canada balsam; cement, watch jewel; film cement, photographic; gasket cement; and gasket shellac compound.

MOE Major Organizational Entities

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DEPARTMENT OF THE ARMY Dept. of the Army
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DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
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DEPARTMENT OF THE NAVY Dept. of the Navy
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