A0510-79027

Semiconductor Device Assembly

NSN 5961-01-069-9653

DEMIL

Shelf Life

UOM

NIIN

Demil:

Shelf Life:

N/A

UOM:

1 EA

NIIN:

010699653

Product Features

Weapon system essential

Detail Specifications

Major Components:

Diode 3; mounting board 1

End Application:

Shipboard material handling equipment (mhe). M970 4x4 5000 gal. Refueler semi trailer. P-10 fire/crash truck. M-915 series m-916a1 let truck. A/s32r-11 refueling truck.

Criticality Code Justification:

Feat

NSN:

5961-01-069-9653

Item Name:

Photo Diode Assembly

Cage Code:

35510

Manufacturer Part Numbers

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

461054C1

Cage Code:

Z0009

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

79027

Cage Code:

24975

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

02-7091655

Cage Code:

62265

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

LN79027

Cage Code:

5Y113

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

02-7091655

Cage Code:

65282

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

79027

Cage Code:

35510

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

35565

FIIG:

T01200

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

0.1000lbs

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

063025

UFC:

34525

LTL:

RATING VARIABLE

LCL:

WCC:

658

TCC:

SHC:

ACC:

Instruments/Radio

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Pricing & Availability

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Definition Definition of approved item name (AIN): "Photo Diode Assembly"

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.