AT28HC256F-12LM883

Memory Microcircuit

NSN 5962-01-362-8124

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
1 EA
NIIN:
013628124

Product Technical Spec.

Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Storage Tempurature Range:
-65.0/+150.0 degrees celsius
Features Provided:
Burn in and electrostatic sensitive and programmed
Inclosure Material:
Ceramic
Inclosure Configuration:
Leadless flat pack
Output Logic Form:
Complementary-metal oxide-semiconductor logic
Input Circuit Pattern:
24 input
Terminal Surface Treatment:
Solder
Voltage Rating And Type Per Characteristic:
6.25 volts power source
Memory Device Type:
Eeprom
Terminal Type And Quantity:
32 leadless
NSN:
5962-01-362-8124
Item Name:
Pal Assembly
Cage Code:
1FN41

Cross Referenced Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
ROM/PROM
Cage Code:
16236
RNCC:
5
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
717801478-002
Cage Code:
04939
RNCC:
3
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
LM28HC256-120/B
Cage Code:
61394
RNCC:
5
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
AT28HC256F-12LMB/883
Cage Code:
1FN41
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
User:
GREECE Greece
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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