BAV23TR

Unitized Semiconductor Devices

NSN 5961-01-507-0943

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
015070943

Product Features

Terminals are gullwing configuration, surface mount

Detail Specifications

Inclosure Material:
Plastic
Overall Length:
Between 2.800 inches and 3.000 inches
Overall Height:
1.100 inches
Overall Width:
Between 1.200 inches and 1.400 inches
End Application:
Cp-1273/upx-2
Joint Electronic Device Engineering Council/jedec/case Outline Designation:
Sot143
Component Name And Quantity:
2 semiconductor device diode
Mounting Method:
Terminal
Semiconductor Material:
Silicon all semiconductor
Voltage Rating In Volts Per Characteristic:
250.0 repetitive peak reverse voltage all semiconductor and 200.0 reverse voltage, total rms all semiconductor
Current Rating Per Characteristic:
625.00 milliamperes forward current, average blank all semiconductor
Power Rating Per Characteristic:
250.0 milliwatts small-signal input power, common-collector preset all semiconductor device diode
Terminal Type And Quantity:
4 bonding pad
NSN:
5961-01-507-0943
Item Name:
Diode Array
Cage Code:
25403

Manufacturer Part Numbers

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
844470-1
Cage Code:
06481
RNCC:
1
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
844470
Cage Code:
06481
RNCC:
D
RNVC:
9
RNAAC:
ZZ
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
4.0 X 2.0 X 2.0
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
060500
UFC:
81820
LTL:
NO RATING
LCL:
--
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Diode Array"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
DSOR:
User:
AUSTRALIA Australia
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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