BU500

Transistor

NSN 5961-01-087-3341

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
010873341

Product Features

Junction pattern arrangement: npn

Technical Specifications of NSN

Inclosure Material:
Metal
Overall Length:
0.450 inches
Overall Diameter:
0.875 inches
Mounting Facility Quantity:
2
Internal Configuration:
Junction contact
Joint Electronic Device Engineering Council/jedec/case Outline Designation:
To-3
Electrode Internally-electrically Connected To Case:
Collector
Mounting Method:
Unthreaded hole
Features Provided:
Hermetically sealed case
Semiconductor Material:
Silicon
Voltage Rating In Volts Per Characteristic:
5.0 breakdown voltage, emitter-to-base, collector open
Current Rating Per Characteristic:
6.00 amperes source cutoff current
Power Rating Per Characteristic:
75.0 watts small-signal input power, common-collector
Maximum Operating Tempurature Per Measurement Point:
165.0 degrees celsius junction
Terminal Type And Quantity:
2 uninsulated wire lead
NSN:
5961-01-087-3341
Item Name:
Hexfet Power Mosfet
Cage Code:
01295

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
TIPL752A
Cage Code:
01295
RNCC:
3
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
400028
Cage Code:
55760
RNCC:
5
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
20588
FIIG:
A110A0
Concept No.:
App. Key:
D
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Hexfet Power Mosfet"

An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
User:
BRAZIL Brazil
DSOR:
User:
SPAIN Spain
DSOR:
User:
FRANCE France
DSOR:
User:
REPUBLIC OF KOREA Republic of Korea
DSOR:
User:
DENMARK Denmark
DSOR:
User:
GREECE Greece
DSOR:
User:
NATO MAINTENANCE AND SUPPLY AGENCY NATO Maintenance and Supply Agency
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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