C1C350

Unitized Semiconductor Devices

NSN 5961-00-520-1329

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
EA
NIIN:
005201329

Technical Specifications of NSN

Inclosure Material:
Metal
Overall Length:
0.188 inches
Terminal Length:
0.500 inches
Overall Diameter:
0.220 inches
Joint Electronic Device Engineering Council/jedec/case Outline Designation:
To-18
Component Name And Quantity:
2 transistor
Mounting Method:
Terminal
Terminal Circle Diameter:
0.100 inches
Semiconductor Material:
Silicon all transistor
Voltage Rating In Volts Per Characteristic:
50.0 drain to gate voltage all transistor
Power Rating Per Characteristic:
300.0 milliwatts total device dissipation all transistor
Maximum Operating Tempurature Per Measurement Point:
200.0 degrees celsius junction
Terminal Type And Quantity:
6 uninsulated wire lead
NSN:
5961-00-520-1329
Item Name:
High Speed Tvs Diode Array
Cage Code:
16067

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
CIC350
Cage Code:
16067
RNCC:
3
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
3-30016
Cage Code:
16067
RNCC:
5
RNVC:
2
RNAAC:
TA
Status:
A
MSDS:
SADC:
Part Number:
CIC350
Cage Code:
25965
RNCC:
C
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
9F
Part Number:
3-30016
Cage Code:
25965
RNCC:
C
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
9F

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
39
LVL_A:
E
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
658
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Privacy | Terms

Definition Definition of approved item name (AIN): "High Speed Tvs Diode Array"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

MOE Major Organizational Entities

Entity
DSOR
User:
SINGAPORE Singapore
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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