DLZ-12A

Unitized Semiconductor Devices

NSN 5961-01-456-5095

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
014565095

Technical Specifications of NSN

Inclosure Material:
Ceramic
Overall Length:
0.910 inches
Terminal Length:
0.165 inches
Overall Height:
0.192 inches
Overall Width:
0.465 inches
Function For Which Designed:
Transient suppressor
End Application:
1055-01-423-7668
Component Name And Quantity:
15 semiconductor device diode
Mounting Method:
Terminal
Semiconductor Material:
Silicon all semiconductor device diode
Voltage Rating In Volts Per Characteristic:
12.0 reverse supression voltage all semiconductor
Current Rating Per Characteristic:
10.00 amperes forward current, average preset all semiconductor device diode
Power Rating Per Characteristic:
500.0 watts small-signal output power, common-base pascal all semiconductor
Maximum Operating Tempurature Per Measurement Point:
-55.0 degrees celsius ambient air and 150.0 degrees celsius ambient air
Terminal Type And Quantity:
16 pin
NSN:
5961-01-456-5095
Item Name:
Diode Matrix
Cage Code:
0U8A3

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
94030-02TX
Cage Code:
037Z3
RNCC:
2
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
94030
Cage Code:
037Z3
RNCC:
4
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
94030-02TX
Cage Code:
67268
RNCC:
5
RNVC:
9
RNAAC:
ZZ
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
X

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Diode Matrix"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE ARMY Dept. of the Army
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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