DMJ4708

Unitized Semiconductor Devices

NSN 5961-01-318-0139

DEMIL

Shelf Life

UOM

NIIN

Demil:

Shelf Life:

N/A

UOM:

1 EA

NIIN:

013180139

Technical Specifications of NSN

Inclosure Material:

Ceramic

Overall Length:

0.040 inches

Overall Diameter:

Between 0.095 inches and 0.105 inches

Component Name And Quantity:

8 semiconductor device diode

Mounting Method:

Press fit

Semiconductor Material:

Silicon all semiconductor device diode

Maximum Operating Tempurature Per Measurement Point:

165.0 degrees celsius junction

Terminal Type And Quantity:

4 pin

NSN:

5961-01-318-0139

Item Name:

Unitized Diodes

Cage Code:

17540

Other Related Parts

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

1906-0279

Cage Code:

50434

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

1906-0279

Cage Code:

28480

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

61962

FIIG:

A110A0

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

0.1000lbs

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

063025

UFC:

34525

LTL:

RATING VARIABLE

LCL:

WCC:

72D

TCC:

SHC:

ACC:

Instruments/Radio

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Pricing & Availability

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Definition Definition of approved item name (AIN): "Unitized Diodes"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.