DMS82108B

Memory Microcircuit

NSN 5962-00-166-6256

DEMIL

Shelf Life

UOM

NIIN

Demil:

DEMIL/MLI

Shelf Life:

N/A

UOM:

1 EA

NIIN:

001666256

Technical Specifications of NSN

Body Length:

Between 0.735 inches and 0.830 inches

Body Width:

Between 0.245 inches and 0.295 inches

Body Height:

Between 0.055 inches and 0.125 inches

Maximum Power Dissipation Rating:

1.0 watts

Operating Tempurature Range:

+0.0/+70.0 degrees celsius

Storage Tempurature Range:

-65.0/+160.0 degrees celsius

Features Provided:

Monolithic and hermetically sealed and positive outputs and low power and 3-state output and wire-or outputs and expandable and w/decoded output and w/buffered output and w/storage

Inclosure Material:

Ceramic and glass

Inclosure Configuration:

Dual-in-line

Output Logic Form:

P-type metal oxide-semiconductor logic

Input Circuit Pattern:

11 input

Terminal Surface Treatment:

Solder

Voltage Rating And Type Per Characteristic:

-20.0 volts power source and 5.0 volts power source

Time Rating Per Chacteristic:

10.00 nanoseconds propagation delay time, low to high level output and 10.00 nanoseconds propagation delay time, high to low level output

Memory Device Type:

Rom

Memory Capacity:

Unknown

Terminal Type And Quantity:

16 printed circuit

NSN:

5962-00-166-6256

Item Name:

Pal Assembly

Cage Code:

16236

Other Related Parts

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

462793-1

Cage Code:

04934

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

C1101A1

Cage Code:

34649

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

11011

Cage Code:

34649

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

C11011

Cage Code:

34649

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

41015

FIIG:

A458A0

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

0.3000lbs

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

061700

UFC:

34580

LTL:

RATING VARIABLE

LCL:

WCC:

658

TCC:

SHC:

ACC:

Instruments/Radio

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Pricing & Availability

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Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.