DZ891025C

Unitized Semiconductor Devices

NSN 5961-01-456-4545

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
014564545

Detail Specifications

Overall Length:
0.930 inches
Terminal Length:
0.190 inches
Overall Height:
0.192 inches
Overall Width:
0.480 inches
Function For Which Designed:
Transient suppressor
End Application:
C-17a aircraft e/i fscm 0u8a3
Mounting Facility Quantity:
16
Component Name And Quantity:
15 semiconductor device diode
Mounting Method:
Terminal
Features Provided:
Hermetically sealed case and electrostatic sensitive and burn in and quality assurance level txv
Semiconductor Material:
Silicon all semiconductor
Voltage Rating In Volts Per Characteristic:
13.0 reverse supression voltage all semiconductor
NSN:
5961-01-456-4545
Item Name:
Common Cathode Matrix
Cage Code:
59377

Manufacturer Part Numbers

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
GZ95017E
Cage Code:
0U8A3
RNCC:
3
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
312A5925P2
Cage Code:
89954
RNCC:
7
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
GZ95017E
Cage Code:
24444
RNCC:
5
RNVC:
9
RNAAC:
ZZ
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
BA
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
00
LVL_A:
Q
LVL_B:
Q

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Common Cathode Matrix"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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