FSA2565M

Unitized Semiconductor Devices

NSN 5961-00-307-4749

DEMIL

Shelf Life

UOM

NIIN

Demil:

Shelf Life:

N/A

UOM:

NIIN:

003074749

Product Features

All semiconductor device diode junction pattern arrangement: pn

Detail Specifications

Inclosure Material:

Plastic

Overall Length:

Between 0.640 inches and 0.736 inches

Terminal Length:

Between 0.125 inches and 0.200 inches

Overall Height:

0.200 inches

Overall Width:

Between 0.220 inches and 0.310 inches

Joint Electronic Device Engineering Council/jedec/case Outline Designation:

To-116

Component Name And Quantity:

13 semiconductor device diode

Mounting Method:

Terminal

Features Provided:

Hermetically sealed case

Semiconductor Material:

Silicon all semiconductor device diode

Voltage Rating In Volts Per Characteristic:

55.0 reverse voltage, peak all semiconductor device diode

Current Rating Per Characteristic:

350.00 milliamperes source cutoff current preset all semiconductor device diode

Power Rating Per Characteristic:

600.0 milliwatts small-signal input power, common-collector absolute all semiconductor device diode

Maximum Operating Tempurature Per Measurement Point:

150.0 degrees celsius ambient air

Terminal Type And Quantity:

14 pin

NSN:

5961-00-307-4749

Item Name:

Diode Array

Cage Code:

07263

Manufacturer Part Numbers

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

11553621

Cage Code:

18876

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

11553621

Cage Code:

3B150

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

GM820ADD1

Cage Code:

26512

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

FSA2565M

Cage Code:

27014

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

11553621

Cage Code:

49956

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

61962

FIIG:

A110A0

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

0.1000lbs

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

063025

UFC:

34525

LTL:

RATING VARIABLE

LCL:

WCC:

658

TCC:

SHC:

ACC:

Instruments/Radio

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Pricing & Availability

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Definition Definition of approved item name (AIN): "Diode Array"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.