IDT6168LA55DB

Memory Microcircuit

NSN 5962-01-248-3547

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
1 EA
NIIN:
012483547

Detail Specifications

Body Length:
Between 0.935 inches and 0.970 inches
Body Width:
Between 0.245 inches and 0.310 inches
Body Height:
Between 0.125 inches and 0.165 inches
Maximum Power Dissipation Rating:
1.0 watts
Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Storage Tempurature Range:
-65.0/+150.0 degrees celsius
Features Provided:
Hermetically sealed and electrostatic sensitive and high speed and low power
Inclosure Material:
Ceramic and glass
Inclosure Configuration:
Dual-in-line
Output Logic Form:
Complementary-metal oxide-semiconductor logic
Input Circuit Pattern:
18 input
Terminal Surface Treatment:
Solder
Voltage Rating And Type Per Characteristic:
7.0 volts power source
Time Rating Per Chacteristic:
55.00 nanoseconds propagation delay time, low to high level output and 55.00 nanoseconds propagation delay time, high to low level output
Memory Device Type:
Ram
Test Data Document:
96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).
Terminal Type And Quantity:
20 printed circuit
NSN:
5962-01-248-3547
Item Name:
Pal Assembly
Cage Code:
61772

Manufacturer Part Numbers

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
7916334-05
Cage Code:
90536
RNCC:
C
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
AF
Part Number:
H990297-004B
Cage Code:
82577
RNCC:
3
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
IDT6168L55DB
Cage Code:
61772
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
39
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
DSOR:
User:
POLAND Poland
DSOR:
User:
SPAIN Spain
DSOR:
User:
AUSTRALIA Australia
DSOR:
User:
NEW ZEALAND New Zealand
DSOR:
User:
GERMANY Germany
DSOR:
User:
TURKEY Turkey
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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