MAT-01H883

Unitized Semiconductor Devices

NSN 5961-01-163-4125

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
UOM:
NIIN:
011634125

Product Features

Internal junction configuration transistor npn

Technical Specifications of NSN

Inclosure Material:
Metal
Overall Length:
0.185 inches
Terminal Length:
0.500 inches
Overall Diameter:
0.370 inches
Joint Electronic Device Engineering Council/jedec/case Outline Designation:
To-99
Component Name And Quantity:
2 transistor
Mounting Method:
Terminal
Terminal Circle Diameter:
0.100 inches
Features Provided:
Hermetically sealed case
Semiconductor Material:
Silicon all transistor
Voltage Rating In Volts Per Characteristic:
60.0 breakdown voltage, collector-to-base, emitter open all transistor
Current Rating Per Characteristic:
25.00 milliamperes source cutoff current all transistor
Power Rating Per Characteristic:
1.8 watts small-signal input power, common-collector preset all transistor
Maximum Operating Tempurature Per Measurement Point:
125.0 degrees celsius ambient air and 150.0 degrees celsius junction
Terminal Type And Quantity:
8 uninsulated wire lead
NSN:
5961-01-163-4125
Item Name:
High Speed Tvs Diode Array
Cage Code:
06665

Other Related Parts

No other part numbers with same form, fit, and function found.

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
X

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Privacy | Terms

Definition Definition of approved item name (AIN): "High Speed Tvs Diode Array"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

MOE Major Organizational Entities

Entity
DSOR
User:
GERMANY Germany
DSOR:
User:
ITALY Italy
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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