MG301-A-064-070A

Memory Microcircuit

NSN 5962-01-594-5058

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
UOM:
NIIN:
015945058

Detail Specifications

Body Length:
Between 0.585 inches and 0.595 inches
Body Width:
Between 0.447 inches and 0.453 inches
Body Height:
Between 0.075 inches and 0.125 inches
Operating Tempurature Range:
+0.0 to 70.0 degrees celsius
Inclosure Material:
Plastic
Inclosure Configuration:
Leaded chip carrier
Output Logic Form:
Complementary-metal oxide-semiconductor logic
Part Name Assigned By Controlling Agency:
Otp eprom
Voltage Rating And Type Per Characteristic:
5.0 volts input
Time Rating Per Chacteristic:
90.0 nanoseconds delay
Memory Device Type:
Eprom
Memory Capacity:
512k
Terminal Type And Quantity:
32 j-hook
NSN:
5962-01-594-5058
Item Name:
Pal Assembly
Cage Code:
Z0EH3

Manufacturer Part Numbers

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
AT27C512R-90JC
Cage Code:
1FN41
RNCC:
3
RNVC:
2
RNAAC:
9Z
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
X

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
AUSTRALIA Australia
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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