MR2864AB-35

Memory Microcircuit

NSN 5962-01-233-2299

DEMIL

Shelf Life

UOM

NIIN

Demil:

DEMIL/MLI

Shelf Life:

N/A

UOM:

1 EA

NIIN:

012332299

Detail Specifications

Body Length:

0.560 inches

Body Width:

0.458 inches

Body Height:

0.105 inches

Maximum Power Dissipation Rating:

770.0 milliwatts

Operating Tempurature Range:

-55.0 to 125.0 degrees celsius

Storage Tempurature Range:

-65.0 to 150.0 degrees celsius

Features Provided:

Electrostatic sensitive and hermetically sealed and monolithic and erasable and programmable and w/enable

Inclosure Material:

Ceramic

Inclosure Configuration:

Leadless flat pack

Output Logic Form:

N-type metal oxide-semiconductor logic

Input Circuit Pattern:

24 input

Terminal Surface Treatment:

Solder

Voltage Rating And Type Per Characteristic:

-1.0 volts power source and 6.0 volts power source

Time Rating Per Chacteristic:

350.00 nanoseconds propagation delay time, low to high level output and 350.00 nanoseconds propagation delay time, high to low level output

Memory Device Type:

Rom

Test Data Document:

96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

Terminal Type And Quantity:

32 leadless

NSN:

5962-01-233-2299

Item Name:

Pal Assembly

Cage Code:

34649

Manufacturer Part Numbers

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

ROM/PROM

Cage Code:

16236

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

160674-03

Cage Code:

35351

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

X2864AEMB-35/C6148

Cage Code:

60395

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

X2864AC6148

Cage Code:

60395

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

41015

FIIG:

A458A0

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

0.1000lbs

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

061700

UFC:

34580

LTL:

RATING VARIABLE

LCL:

77.5

WCC:

738

TCC:

SHC:

ACC:

Instruments/Radio

We Guarantee with Every Order

100% Genuine Manufacturers Parts
Every Product thoroughly Inspected
Sales Record Retention of 7 years
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Pricing & Availability

Submit this form for current pricing and availability quote on part number mr2864ab-35 and/or cross reference parts.

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.