NSR8141

Unitized Semiconductor Devices

NSN 5961-01-337-7232

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
013377232

Product Features

All semiconductor device diode junction pattern arrangement: pn

Product Technical Spec.

Inclosure Material:
Metal
Overall Length:
1.573 inches
Overall Height:
0.350 inches
Overall Width:
1.050 inches
Mounting Facility Quantity:
2
Joint Electronic Device Engineering Council/jedec/case Outline Designation:
T0-3
Electrode Internally-electrically Connected To Case:
Cathode
Component Name And Quantity:
2 semiconductor device diode
Mounting Method:
Unthreaded hole
Semiconductor Material:
Silicon all semiconductor device diode
Voltage Rating In Volts Per Characteristic:
200.0 reverse voltage, peak all semiconductor device diode
Current Rating Per Characteristic:
30.00 amperes collector current, dc peak all semiconductor device diode
Terminal Type And Quantity:
2 pin and 1 case
NSN:
5961-01-337-7232
Item Name:
Diode Matrix
Cage Code:
51182

Cross Referenced Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
6206
Cage Code:
7T184
RNCC:
3
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
NSR8241-01
Cage Code:
51182
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
NSR8241
Cage Code:
51182
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Diode Matrix"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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