ROMPROM

Memory Microcircuit

NSN 5962-00-137-5006

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
1 EA
NIIN:
001375006

Detail Specifications

Body Length:
0.390 inches
Body Width:
0.390 inches
Body Height:
0.070 inches
Maximum Power Dissipation Rating:
307.2 milliwatts
Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Storage Tempurature Range:
-65.0/+150.0 degrees celsius
Features Provided:
Hermetically sealed and monolithic and positive outputs and bipolar and negative outputs and unipolar and programmable and programmed and w/enable and wire-or outputs
Inclosure Material:
Ceramic and glass
Inclosure Configuration:
Flat pack
Output Logic Form:
P-type metal oxide-semiconductor logic
Input Circuit Pattern:
12 input
Terminal Surface Treatment:
Solder
Voltage Rating And Type Per Characteristic:
-20.0 volts power source and 8.3 volts power source
Time Rating Per Chacteristic:
900.00 nanoseconds propagation delay time, low to high level output
Memory Device Type:
Rom
Memory Capacity:
Unknown
Test Data Document:
09128-d34005544 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
Terminal Type And Quantity:
30 flat leads
NSN:
5962-00-137-5006
Item Name:
Pal Assembly
Cage Code:
16236

Manufacturer Part Numbers

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
D34005544-010
Cage Code:
09128
RNCC:
3
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
D34005544-010
Cage Code:
21845
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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