TMS27C512-25JE

Memory Microcircuit

NSN 5962-01-345-2684

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
1 EA
NIIN:
013452684

Technical Specifications of NSN

Overall Length:
Between 1.435 inches and 1.465 inches
Overall Height:
Between 0.290 inches and 0.375 inches
Overall Width:
Between 0.644 inches and 0.720 inches
Body Length:
Between 1.435 inches and 1.465 inches
Body Width:
Between 0.514 inches and 0.598 inches
Body Height:
Between 0.140 inches and 0.175 inches
Operating Tempurature Range:
-40.0/+85.0 degrees celsius
Storage Tempurature Range:
-65.0/+150.0 degrees celsius
Features Provided:
Ultraviolet erasable and programmable and w/enable and positive outputs and electrostatic sensitive
Inclosure Material:
Ceramic
Inclosure Configuration:
Dual-in-line
Output Logic Form:
Complementary-metal oxide-semiconductor logic
Input Circuit Pattern:
18 input
Current Rating Per Characteristic:
30.00 milliamperes reverse current, dc absolute
Terminal Surface Treatment:
Solder
Part Name Assigned By Controlling Agency:
Have quick decoder, u23
Voltage Rating And Type Per Characteristic:
-0.6 volts power source and 7.0 volts power source
Capitance Rating Per Characteristic:
10.00 input pascal dense structural 65 and 14.00 output pascal dense structural 65
Time Rating Per Chacteristic:
250.00 nanoseconds access
Memory Device Type:
Eprom
Unpackaged Unit Weight:
7.5 grams
Terminal Type And Quantity:
28 printed circuit
NSN:
5962-01-345-2684
Item Name:
Pal Assembly
Cage Code:
01295

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
ROM/PROM
Cage Code:
16236
RNCC:
5
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
100888-001
Cage Code:
55761
RNCC:
5
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
27C512I-20FA
Cage Code:
18324
RNCC:
5
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
100928-001
Cage Code:
55761
RNCC:
3
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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