VBE890-2N3495

Transistor

NSN 5961-00-929-2967

DEMIL

Shelf Life

UOM

NIIN

Demil:

Shelf Life:

N/A

UOM:

NIIN:

009292967

Product Features

Junction pattern arrangement: pnp

Technical Specifications of NSN

Internal Configuration:

Junction contact

Features Provided:

Hermetically sealed case

Semiconductor Material:

Silicon

Terminal Type And Quantity:

3 uninsulated wire lead

NSN:

5961-00-929-2967

Item Name:

Hexfet Power Mosfet

Cage Code:

H0203

Other Related Parts

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

51-0214-001

Cage Code:

80091

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

RELEASE4831

Cage Code:

80131

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

2N3495

Cage Code:

80131

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

352250010232

Cage Code:

H0203

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

2N3495

Cage Code:

01295

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

40-666-5233

Cage Code:

K0802

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

2N3495

Cage Code:

02929

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

207037P2

Cage Code:

94117

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

2N3495

Cage Code:

04713

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

2N3495

Cage Code:

03776

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

20588

FIIG:

A110A0

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

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Pricing & Availability

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Definition Definition of approved item name (AIN): "Hexfet Power Mosfet"

An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.