VSK3040T

Unitized Semiconductor Devices

NSN 5961-01-217-0614

DEMIL

Shelf Life

UOM

NIIN

Demil:

Shelf Life:

N/A

UOM:

1 EA

NIIN:

012170614

Technical Specifications of NSN

NSN:

5961-01-217-0614

Item Name:

High Speed Tvs Diode Array

Cage Code:

24039

Other Related Parts

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

1058346-1

Cage Code:

52315

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

1058346-1

Cage Code:

3B150

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

S30SC4M

Cage Code:

S5405

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

S30SC4MT-5000

Cage Code:

S5404

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

S30SC4MT

Cage Code:

S5405

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

SKS503

Cage Code:

24039

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

S30SC4M

Cage Code:

S5404

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

1058346-1

Cage Code:

49956

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

1058346-1

Cage Code:

54X10

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

61962

FIIG:

A110A0

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

0.2000lbs

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

060500

UFC:

81820

LTL:

NO RATING

LCL:

WCC:

72D

TCC:

SHC:

ACC:

Instruments/Radio

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Pricing & Availability

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Definition Definition of approved item name (AIN): "High Speed Tvs Diode Array"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.