X2064

Unitized Semiconductor Devices

NSN 5961-01-024-4373

DEMIL

Shelf Life

UOM

NIIN

Demil:

Shelf Life:

N/A

UOM:

1 EA

NIIN:

010244373

Detail Specifications

Overall Length:

0.468 inches

Overall Height:

0.312 inches

Overall Width:

0.302 inches

End Application:

Aircraft, viking s-3b

NSN:

5961-01-024-4373

Item Name:

Diode Array

Cage Code:

28564

Manufacturer Part Numbers

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

KW105S-TB/L

Cage Code:

58774

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

03210

Cage Code:

28564

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

06-L50

Cage Code:

28564

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

06-50-X2064

Cage Code:

28564

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

61962

FIIG:

A110A0

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

0.1000lbs

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

063025

UFC:

34525

LTL:

RATING VARIABLE

LCL:

WCC:

658

TCC:

SHC:

ACC:

Instruments/Radio

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Pricing & Availability

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Definition Definition of approved item name (AIN): "Diode Array"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.