X28C64EMB-30

Memory Microcircuit

NSN 5962-01-412-5953

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
EA
NIIN:
014125953

Product Technical Spec.

Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Inclosure Material:
Ceramic
Inclosure Configuration:
Leadless flat pack
Terminal Surface Treatment:
Solder
Part Name Assigned By Controlling Agency:
Programmable cmos 8k x 8 eeprom
Voltage Rating And Type Per Characteristic:
6.25 volts power source
Time Rating Per Chacteristic:
300.00 nanoseconds access
Memory Device Type:
Eeprom
Terminal Type And Quantity:
32 leadless
NSN:
5962-01-412-5953
Item Name:
Message Processor Escc Control During Dma
Cage Code:
60395

Cross Referenced Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
5962-8751402YA
Cage Code:
67268
RNCC:
2
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
5962-87514
Cage Code:
67268
RNCC:
4
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
ROM/PROM
Cage Code:
16236
RNCC:
5
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
5962-8751402YB
Cage Code:
67268
RNCC:
5
RNVC:
9
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
5962-8751402YX
Cage Code:
67268
RNCC:
5
RNVC:
9
RNAAC:
ZZ
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
BA
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
39
LVL_A:
Q
LVL_B:
Q

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Message Processor Escc Control During Dma"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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