XDS226N

Transistor

NSN 5961-00-435-3431

DEMIL
Shelf Life
UOM
NIIN
Demil:
NO
Shelf Life:
N/A
UOM:
1 EA
NIIN:
004353431

Product Features

Junction pattern arrangement: npn

Technical Specifications of NSN

Inclosure Material:
Metal
Overall Length:
0.260 inches
Terminal Length:
0.500 inches
Overall Diameter:
0.370 inches
Internal Configuration:
Junction contact
Mounting Method:
Terminal
Terminal Circle Diameter:
0.200 inches
Features Provided:
Hermetically sealed case
Semiconductor Material:
Silicon
Voltage Rating In Volts Per Characteristic:
1.3 base to emitter saturation voltage and 1.0 collector to emitter voltage, dc
Current Rating Per Characteristic:
2.00 microamperes zero-gate-voltage source current preset
Maximum Operating Tempurature Per Measurement Point:
200.0 degrees celsius junction
Terminal Type And Quantity:
3 uninsulated wire lead
NSN:
5961-00-435-3431
Item Name:
Hexfet Power Mosfet
Cage Code:
53178

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
104726
Cage Code:
56200
RNCC:
C
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
AC
Part Number:
104726
Cage Code:
18338
RNCC:
3
RNVC:
9
RNAAC:
TA
Status:
A
MSDS:
SADC:
Part Number:
XDS226N
Cage Code:
33322
RNCC:
5
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
SDS226
Cage Code:
18338
RNCC:
5
RNVC:
9
RNAAC:
TA
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
20588
FIIG:
A110A0
Concept No.:
App. Key:
D
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
658
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Hexfet Power Mosfet"

An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
DSOR:
User:
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION National Aeronautics and Space Administration
DSOR:
User:
SINGAPORE Singapore
DSOR:
User:
GERMANY Germany
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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